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SH-3000 | |
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System Specification |
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Measurement |
1. Thickness & Flatness 2. Bow & 15 points Warp |
Wafer Inner Inspection |
1. Micro Crack Detection 2. Inner Bubble & Defects Detection |
Wafer Surface Inspection |
1. Surface Crack Detection 2. Detection of the Foreign Material and the Contamination of the Wafer Surface 3. Edge Chipping Detection 4. Saw Mark Detection 5. Size Measurement 6. Squareness & Parallelization |
产品目录 |
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咨询: +82-2-465-9020 | | |
※ 按User的要求事项可变更System Customize |
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Solar Cell检查系统 |
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目前Solar Wafer生产线还没有形成标准化和自动化,因此难以实现大量生产和有效形成生产工序是个难题。 该设备是运用Vision检查技术来设计的自动化系统 |
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按以上技术开发实现了 检查自动化。通过该设备可期待品质稳定和提高产能效果。 |
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