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SH-3000 | |
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 System Specification
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Measurement |
1. Thickness & Flatness 2. Bow & 15 points Warp |
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Wafer Inner Inspection |
1. Micro Crack Detection 2. Inner Bubble & Defects Detection |
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Wafer Surface Inspection |
1. Surface Crack Detection
2. Detection of the Foreign Material and the Contamination of the Wafer Surface
3. Edge Chipping Detection
4. Saw Mark Detection
5. Size Measurement
6. Squareness & Parallelization |
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Product Catalog |
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TEL: +82-2-465-9020 | | |
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※ This system can be customized for the customer's needs. |
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Solar Cell Inspection System |
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Solar Wafer Production Line has a problem to achieve mass production because of the standardization and automation problems.
This system is vision inspection technoly applied and has automatic operating capability. |
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Througe this system quality stability and higher productivity can be achived. |
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 Top of page
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Thickness variation measurement techniques which use laser technology (ASTM standard)
